UMCi revs production

March 2, 2004 – UMCi, the Singapore-based 300mm fab of United Microelectronics (UMC), has started volume production with “good wafer yields” of copper interconnect-based chips for FPGA and wireless communications. The company installed back-end-of-line copper equipment in January 2003, with front-end-of-line equipment moved in at the end of 2003.


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