Unitive develops, qualifies electroplated lead-free bumping technology

“This technology was developed and qualified over 2 years in our U.S. facility, then transferred to our Unitive Semiconductor Taiwan (UST) facility in Hsinchu,” says Dan Mis, Unitive’s vice president of technology integration.

(March 17, 2004) Phoenix, Ariz.&#8212FlipChip International LLC has achieved high-volume production of lead-free bumping and wafer-scale packaging services for several customers, according to the company.


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