March 19, 2004 – Winbond Electronics Corp. and Etron Technology Inc. have received “lucrative” orders from Intel and Sharp to bundle their memory chips with multichip package products in next-generation handsets, according to the China Economic News Service.

With the deal, Winbond is boosting production of 1T SRAM chips 10,000 wafers/quarter to 15,000 wafers two firms’ shipments of 1T SRAM and SDRAM chips by 50% in the current quarter to 15,000 8-in. wafers, and to 20,000 wafers in 2Q.

Etron is subcontracting with PowerChip Semiconductor Co. and SMIC to produce 1T SRAM and SDRAM chips, with Powerchip setting aside 10% of capacity at its 12-in. fab to produce the chips using 0.13-micron processes.