Amkor’s Bird named chair of JEDEC Mechanical Standardization Committee

This committee covers mechanical standardization of a broad range of semiconductor package formats, including: PLCC, SOIC, QFP and BGA; advanced package applications such as FBGA, SON, QFN, and wafer scale BGA; and also modules, system-in-package and stacked die packages. In addition to covering mechanical package outlines, JC-11 also creates design guides for future variations and families, as well as the next level package interface media such as test carriers, matrix trays and shipping tubes, test sockets, and contactors.

(April 5, 2004) San Jose, Calif.&#8212Worldwide sales of semiconductors in February 2004 rose 30.8 percent, reports the Semiconductor Industry Association (SIA), compared to February 2003. While total sales of $15.58 billion reflect a modest 0.2 percent increase from January 2004, the SIA noted that February historically has been a relatively weak month for chip sales.


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