Euro firms combine for MEMS packaging

April 20, 2004 – Alphasem AG, Berg, Switzerland, a supplier of die attach equipment, has acquired Sister Semiconductor Equipment GmbH (SSE), Singen, Germany, a one-year-old company that manufactures equipment for coating, micropatterning, and wafer-handling applications. The acquisition is targeted at expanding Alphasem’s die-bonding process into both upstream and downstream processes, with an eye toward production and packaging of MEMS modules.


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