FSA study finds 6% price hike in wafers using 0.13-micron process geometry

The majority of participants ordered 0.18-micron process geometry, with more than 27 percent of fabless participants and 22 percent of IDMs ordering wafers using this process geometry. In Q1 2004, 12 percent of fabless wafer orders included 0.13-micron process geometry, compared to 10 percent of all IDM orders placed for the same process.

(April 22, 2004) Palo Alto, Calif.&#8212The burgeoning growth of telecommunications in Asia is helping the electronic components and packaging market recover from the economic downturn, according to a new study from Frost & Sullivan. The study, World Electronic Components and Packaging Market, finds that revenue in this market totaled $8.25 billion in 2003 and is projected to reach $17.10 billion by 2010.


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