Intel will begin shipping the lead-free technology with select microprocessors and chipsets in Q3, 2004, and embedded IA processors in Q2, 2004. The company shipped its first lead-free memory chips last year. Additional products will be transitioned as manufacturers become able to handle them. The new packages use lead-free solder balls, about the size of salt crystals, and represent the majority of lead used in Intel microprocessor packaging. Intel is working with the industry to find a reliable solution for the tiny amount of lead still needed inside the processor packaging to connect the actual silicon “core” to the package.
(April 8, 2004) Pleasanton, Calif. —ASAT Holdings Ltd., a provider of semiconductor package design, assembly and test services, and the Hong Kong Science and Technology Parks Corp. (HKSTP) have formed an alliance to cooperatively promote IC packaging and test related services in Hong Kong and China.