Key to robust IC market is to avoid inflating prices, study says

Both worldwide units and worldwide revenues have shared a similar growth rate, about 15 percent, (calculated using a 12 month moving average) for the last seven months after nearly a year of lagging revenue growth, as the industry was recovering from the 2001 recession.

(April 15, 2004) Research Triangle Park, N.C.&#8212Unitive Inc. has opened a new Die Level Processing (DLP) facility, which the company says represents the industry’s most advanced turnkey chip scale packaging capability. Integrated services include design, wafer bumping, multilayer redistribution, backgrind, dicing, probe, tape and reel, backside laminate, backside metallization and laser marking.


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