“As a leader in packaging technology, National is committed to providing its customers with state-of-the-art chip technologies in the widest possible range of products and package types,” says Kamal Aggarwal, executive vice president, Central Technology Manufacturing Group at National. “With our lead-free packaging program, National is extending its effort to make innovative, high-performance products that are environmentally friendly and easier to recycle. As soon as our customers require lead-free packages, we will provide them.”

(April 14, 2004) Milpitas, Calif.&#8212ST Assembly Test Services Ltd. (STATS) has expanded its die stacking technologies to exposed pad leadframe-based packages to enable higher thermal performance and cost-effective solutions for consumer, communications, wireless handheld and portable consumer applications.