NEC building out 300mm facility

April 5, 2004 – NEC Electronics Corp. is expanding 300mm wafer production at the site of its subsidiary NEC Yamagata Ltd. The new 5 billion yen 300mm plant, adjacent to an existing 300mm wafer fab line, will have a total capacity of 10,000 wafers/month when operational; the original building, under construction since late 2003, has a capacity of 4000 wafers/month. Construction on the new building is scheduled to start in May 2004, with completion slated for December 2004.


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