STATS expands die stacking to exposed pad leadframe-based packages

The company’s latest offering, Stacked Die Exposed Pad Low Profile Quad Flat Pack (SDepLQFP), combines its die stacking and lead-free exposed pad leadframe technologies. The package is designed for cost-sensitive die stacking applications that involve the integration of logic and memory chips.

(April 14, 2004) Saratoga,Calif.&#8212Growth in worldwide IC revenues is being driven primarily by increased demand for IC units, as opposed to rising ASP &#8212 a positive sign indicating this boom isn’t over yet, according to Advanced Forecasting, a quantitative semiconductor forecasting house.

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