Unitive opens die level processing facility

“This is a crucial development in the improvement of the semiconductor industry infrastructure, which will clearly serve to expand the market potential for both flip chip and wafer-level packages,” says Jan Vardaman, president of industry research firm TechSearch International. “The semiconductor industry is experiencing strong growth in the IC package subcontract assembly segment of the industry. Not only are the companies merging operations, they are becoming vertically integrated. With the close link between wafer bumping and wafer-level packaging and assembly, this announcement will clearly save Unitive’s customers both time and money.”

(April 20, 2004) San Jose, Calif.&#8212North American-based manufacturers of semiconductor equipment posted $1.32 billion in orders in March 2004 (three-month average basis) and a book-to-bill ratio of 1.10, according to SEMI’s latest report.


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