Philips proves first silicon for 90nm CMOS

May 11, 2004 – Royal Philips Electronics has achieved “right-first-time” silicon in its 90nm CMOS production line, both at the Crolles2 wafer fab in France and TSMC’s fab in Taiwan. The lead silicon uses an ARM processor core with SRAM, ROM, and analog signal circuitry, designed for wireless applications.

Jan-Marc Luchies, 90nm CMOS manager at Philips, also applauded the consistent results between the Crolles2 and TSMC fabs. “This means that the early work done by the Crolles2 partners [Motorola and STMicroelectronics] and TSMC in aligning the processes at the two fabs, both in terms of design rules and electrical parameters, has really paid off.”

With the achievement, Philips said it is on track for production volumes of 90nm CMOS products this year, in line with the International Technology Roadmap for Semiconductors (ITRS).


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