“The strength in bookings for new semiconductor manufacturing equipment in early 2004 is consistent with both announced capital spending plans and high capacity utilization levels reported by semiconductor manufacturers,” says Stanley T. Myers, president and CEO of SEMI. “The capacity utilization trends are supported both by strong semiconductor unit growth and silicon wafer shipments in the first quarter.”

(May 27, 2004) Natick, Mass.&#8212A number of 3-D chip scale packaging (CSP) studies conducted by VDC, a technology market research and consulting firm, indicate that 3-D chip scale packaging solutions will play an increasingly vital role in meeting performance and size requirements for future generations of mobile electronics.