IEEE CPMT Society announces ’04 award winners

“These awards acknowledge tremendous contributions in many diverse topic areas that ultimately advance science. Their contributions lead to innovative solutions that enhance life around the globe,” says N. Rao Bonda, CPMT Society awards chair.

(June 14, 2004) Des Plaines, Ill. and Phoenix &#8212 Kester and FlipChip International (FCI) have worked side by side to introduce SE-CURE 7501, a low void wafer bumping solder paste formula designed for FCI’s proprietary wafer bumping application.

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