June 14, 2004 – Intel Corp. said its Fab 24 facility in Leixlip, Ireland, has begun production of 300mm wafers using 90nm process technology. It’s Intel’s fourth 300mm facility, joining sites in Oregon and New Mexico, and the third to incorporate 90nm technology.

Last month Intel announced it would invest 1.6 billion euros (nearly $2 billion) to expand its Fab 24 facilities to enable 65nm process technologies, with production slated to begin in 1H06.

Earlier this year, the company also began converting its Fab 12 200mm wafer fab in Chandler, AZ, to a 300mm/65nm facility, expected to be completed by late 2005.