Kester, Flip Chip International Collaborate on Development of New Wafer Bumping Solder Paste

The printing performance of 7501 reportedly features a stable performance down to 70 micron pitches. The stable printing performance of SE-CURE 7501 provides overall consistency of bump height across the wafer as well as from wafer to wafer.

(June 16, 2004) Sunnyvale, Calif. &#8212 Honeywell announces that the company will be implementing price increases between 4 to 14 percent for part of its Electronic Chemicals product line.

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