June 22, 2004 – Wafer manufacturer Siltronic AG has opened the doors of its 300mm facility in Freiberg, Germany, after 18 months of construction.
The 430 million euro facility, partially funded by the German government, is the largest single investment project ever undertaken by Siltronic’s parent company, Wacker-Chemie GmbH.
In addition to facilities in Burghausen, Siltronic’s overall 300mm capacity now is 125,000 wafers/month. By 2007, the company plans to raise output of 350,000 wafers/month, and is “already considering building another plant,” according to CEO Wilhelm Sittenthaler.