TSMC raises output, reports 300mm yields

June 14, 2004 – TSMC said it has boosted production at its Fab 6 facility to a record 70,000 200mm wafers/month, higher than its planned 2Q04 capacity of 64,000 wafers/month. Half of the wafers were manufactured using 0.13-micron process technologies, with a significantly-increased percentage of wafers using low-k dielectrics, according to the company.

TSMC also said its Fab 14 plant has successfully produced high-yield 300mm wafers at levels equalling those from its Fab 12 operations, just 90 days after initial installation of process equipment.

Together, the two facilities in Hsinchu’s Tainan Science Industrial Park are expected to contribute 17% of the company’s total wafer capacity by the end of this year, and reach 25% by the end of 2005.


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