TSMC’s Fab 6 produces 70,000+ 200mm wafers/month

June 14, 2004 — At Taiwan Semiconductor Manufacturing Co. (TSMC)’s Fab 6, which accounts for 16% of the company’s total wafer capacity, production has exceeded 70,000 200mm wafers/month.

With its record production volume of 70,000 200mm wafers in May, Fab 6 outperformed its planned monthly installed capacity of 64,000 200mm wafers in the second quarter of this year, to accommodate customers’ increased demand.

In addition, TSMC’s Fab 14, its second pure 300mm fab, has successfully delivered high-yield 300mm customer wafers ahead of schedule. Fab 14 achieved this milestone in a short 90 days after installation of the first process equipment.

Both fabs are located in Taiwan’s Tainan Science Industrial Park (TSIP). With Fab 14’s ramping up by the end of 2004, the total capacity of TSMC’s fabs in TSIP is expected to increase to 17 percent of TSMC’s total wafer capacity. The figure is expected to reach approximately 25 percent by the end of 2005.


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