“The rigorous thermal requirements of this 90-nm family of devices housed in flip-chip, lead-free packages were met by applying Shin-Etsu’s thermal interface material,” said Tarun Verma, director of package engineering at Altera. “Shin-Etsu’s material exhibits excellent thermal characteristics, and its low modulus helps absorb stress between the integrated heat spreader in the package and pressure sensitive-low-k dielectric material in the silicon.”

(July 23, 2004) City of Industry, Calif.&#8212Henkel Technologies today announced an initiative to market its products under a single, comprehensive banner and distance itself from its competition. The move will enable Henkel to drive increased visibility of its well-known Hysol, Loctite and Multicore advanced technology products and services.