Through these acquisitions, Amkor will gain industry-leading technology for electroplated wafer bumping and turnkey wafer level “chip scale” packaging, together with installed and operationally qualified, high volume 200mm and 300mm electroplated wafer bumping and wafer level packaging manufacturing operations. Unitive, Inc. is in the forefront of development in “back-end” wafer level processing technologies, including wafer level CSP, electroplated lead-free and low alpha wafer bumping, fine pitch solder bumps, redistribution and multi-layer thin film capabilities.

(BUSINESS WIRE, July 22, 2004) Petaluma, Calif.&#8212Tegal Corporation has been granted United States Patents Nos. 6,689,220 and 6,756,318, which enable nano layer deposition (NLD) of conformal thin films for barrier, copper seed and high-K dielectric applications in advanced microprocessor and memory device production.