Mattson wins orders from Hynix Semiconductor for DRAM production

July 14, 2004 – Mattson Technology Inc. has won multiproduct system orders from Hynix Semiconductor Inc. for the production of dynamic random access memory (DRAM) devices in its new T1 300mm wafer fabrication plant in Ichon, South Korea.

Mattson’s new Helios rapid thermal processing (RTP) and multiple Aspen III plasma tools, including the Aspen III ICPHT Strip system, are expected to be installed in Hynix’ new fab for its 300 mm pilot line by the end of August 2004.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.