Mitsubishi Heavy receives order for chipmaking equipment

July 28, 2004 – Mitsubishi Heavy Industries Ltd. said it has received an order from Seiko Epson Corp. for equipment to form insulating layers on semiconductor wafers, reports Jiji Press Ltd.

Mitsubishi Heavy delivered the equipment to Seiko Epson’s Chitose plant in Hokkaido Prefecture, which produces rear-projection television sets using thin-film transistor liquid crystal displays. The deal was worth over 400 million yen, Mitsubishi Heavy said.

The plasma chemical vapor deposition equipment, called MAPLE-300, can handle 300mm wafers and increase manufacturing yields. Mitsubishi Heavy is aiming to achieve annual sales of 10 to 15 units of the MAPLE-300 in the future, company officials said.

The MAPLE-300 is the second series of Mitsubishi Heavy’s chipmaking equipment, following the MAPLE-200, which Fujitsu Ltd. ordered in November 2003.


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