Companies seeking single-wafer solutions for UBM etch are expected to include full-service packaging and test houses, as well as smaller, pure-play bump providers. SEZ’s multi-chamber single-wafer wet technology offers these companies advantages for 300-mm printing and plating solder bump applications, as well as seed layer etching for redistribution layers.

(July 13, 2004) San Francisco, Calif.&#8212Leading semiconductor equipment manufacturers expect sales to increase 63 percent this year from the $22.2 billion posted in 2003, according to the mid-year edition of the SEMI Capital Equipment Consensus Forecast. This forecast was released yesterday at the SEMICON West 2004 exposition.