Shenzhen Kaifa enters joint venture with three U.S. companies

In June 2004, Shenzhen Kaifa announced the establishment of Shenzhen Payton Technology Company Limited with three other companies, Payton Technology Corporation, Tu ShenZhen, LLC and Sun Shenzhen, LLC. With registered capital of $100 million, the new company will develop and produce semiconductor parts, very large-scale integration with circuit breadth of less than 0.35 &#181m and new electronic parts.

(August 2, 2004) San Jose, Calif.&#8212Tessera Technologies, Inc., a services provider for semiconductor chip-scale and multi-chip packages, announced today that it has signed an agreement that expands the license terms of its existing agreement with Sharp Corporation, a leading consumer electronics company.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.