SMIC signs on to build Chengdu City IC testing, packaging plant

July 19, 2004 – Semiconductor Manufacturing International Corp. (SMIC) has signed an agreement on an investment project in Chengdu City with Chengdu Municipal Government for constructing an IC testing and packaging plant.

The overall investment in the project is expected to be US$175 million, and it will be put into operation a year later, according to Financial Times Information Ltd. through Chinese SinoCast news.

At the moment, SMIC has three 8-inch wafer manufactories in Shanghai, and it is operating a 8-inch wafer manufactory in Tianjin. The company is also building a 12-inch wafer manufactory in Beijing.

The president of SMIC predicts that Chengdu will be the third IT industry center following Yangtze River delta and Pearl River delta areas.


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