The systems and methods described in the two patents enable NLD with ultra-conformality similar to that of atomic layer deposition (ALD) and the manufacturing throughput of more conventional chemical vapor deposition systems. NLD allows semiconductor manufacturers to choose from a wide field of deposition precursors for the application of any thin film in use today on the surface of a wafer with atomic layer precision.

(July 22, 2004) Phoenix, Ariz.&#8212Tokyo-based Shin-Etsu Chemical Co., Ltd. announced today that Altera Corporation will use its thermally conductive interface gel material in the packaging of its high-end Stratix II FPGA family. Shin-Etsu’s thermally conductive gel enables rapid heat transfer from IC packages and facilitates the dissipation of the heat generated during operations. Featuring a new logic structure, Stratix II devices offer more than twice the logic density and 50 percent higher performance at 40 percent lower cost than first-generation Stratix devices.