Tower pushes toward 0.13-micron adoption

July 13, 2004 – Tower Semiconductor, Migdal Haemek, Israel, plans to ramp production of 0.13-micron process technologies in its Fab 2 facility by early 2005.

The foundry said that it has “proven silicon and stable yield performance at Motorola’s fab,” and has ordered the first toolsets to equip Fab 2, including a 193nm scanner and additional tools for all-copper process technology.

Tower estimated its capex spending would be $150-$200 million this year, including investments in the 0.13-micron ramp as well as recent purchases of 0.18-micron production capacity at Fab 2.


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