Winbond building $2.5B 300mm fab

July 26, 2004 – Winbond Electronics Corp. has begun construction of its $2.5 billion 300mm fab in the Central Taiwan Science Park in Taichung.

Equipment move-in is scheduled to take place by May 2005, with pilot production by 4Q05 of 24,000 wafers/month. Mass production of 48,000 wafers/month will begin by 1Q06, one quarter than initially reported. The facility initially will incorporate 0.11-micron process technology, later shifting to 90nm and below, and will focus on specialty DRAM, flash memory, and MRAM chips.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.