AIM forms new semiconductor packaging materials division

AIM Semiconductor Packaging Materials supplies products such as BGA solder spheres, preforms, epoxies, BGA/CSP fluxes, solder pastes and touch-up materials to the semiconductor packaging industry.

(August 18, 2004) San Francisco, Calif.&#8212Money spent worldwide on research and development in the nanotechnology field should rise about 10 percent in 2004 to $8.6 billion, according to a report released by Lux Research Inc., a New York-based research and consulting firm.


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