August 26, 2004 – Albany Nanotech, the nanotechnology center located at the U. of Albany/State U. of New York, said that its College for Nanoscale Science and Engineering (CSNE) has installed and begun qualifying for 300mm wafers using a 193nm preproduction immersion lithography system.

Under the project, researchers and engineers from ASML, IBM, Tokyo Electron, AMD, and Infineon are working jointly at the Albany site to demonstrate and optimize materials and processes for 193nm immersion lithography. The clustered 300mm wafer scanner-track platform includes two components: ASML’s TwinScan AT:1150i scanner, and a TEL Clean track Lithius coater/developer system; AMD and Infineon will work with IBM and CNSE to use the ASML tool for developing immersion lithography processes and applications.

While promoting the system’s early progression, several of the participants also noted their appreciation of the industry/academic/R&D collaboration itself. “Resulting industry-university programs will…[ensure] an unparalleled research capability that will provide immediate scientific and technical solutions,” said Alain Kaloyeros, VP and chief administrative officer of CSNE.

Echoed Martin van den Brink, EVP, marketing and technology, ASML: “In the future, the introduction of new technologies will require this type of early collaboration.”