The production line uses an inkless process based on an advanced wafer mapping program, developed by Best, that electronically merges bump maps, electrical sort maps, and vision inspection maps for all formats into one composite map that controls the selection and taping of all devices. This inkless electronic mapping process eliminates unnecessary manufacturing operations, increases the quality level, and increases production throughput by 400 percent.

(August 25, 2004) Milpitas, Calif.&#8212LSI Logic, in response to customer demands and global environmental initiatives, now offers chip products with lead (Pb)-free packaging. While no legislation currently exists that would prohibit the sale of Pb-based products in the United States, LSI Logic has conducted its own initiative to provide Pb-free packaging for its customers.