Chip architecture firm reveals progress

August 3, 2004 – 3Plus1Technology Inc., Saratoga, CA, has unveiled details about itself and its work on multiprocessor architecture for running next-generation handheld systems.

The company aims to offer low-power, concurrent execution of a variety of applications, including MPEG, JPEG, Bluetooth, CDMA/WCDMA, and MP3, in various combinations, which the company said it has accomplished in a sub-100MW processor, implemented in a standard 130nm low-power CMOS process. Among 3Plus1’s stated partners are ARM (RISC processor design and manufacturing), CoWare Inc. (system simulation), Hellosoft Inc. (application software), and Sonics Inc. (SoC integration).

The company’s technology also is used in “CoolProcessor” devices for low-power mobile systems, the first of which is planned for release in 2Q05.


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