ChipMOS to purchase test and assembly assets from FICTA

Under this agreement, the assets to be purchased from FICTA include wafer testers, final testers, assembly equipment for memory products. S.J. Cheng, chairman and CEO of ChipMOS, said, ”This transaction is expected to expand our capacity for the assembly and testing of memory semiconductors by 12 million pieces monthly. This is the latest example of our proven track record of successfully acquiring and transferring equipment into our operations to support customer demand in a timely and cost-effective manner.”

(August 25, 2004) Santa Clara, California&#8212Best Electronics and Components Company, Inc., a contract test facility for analog and mixed signal semiconductors, has successfully established a high-volume chip scale package (CSP) production line. This new production line can electrically sort, laser mark, visually inspect, tape, and reel multiple wafer scale devices and QFN packages at production volumes of 2,000,000 devices per week.


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