Dow, Brewer team for 248-193nm films

August 5, 2004 – Dow Chemical Co., Midland, MI, and Brewer Science, Rolla, MO, have agreed to codevelop bottom antireflective coatings for 248-193nm lithography applications.

The multiyear deal involves the development of materials within Dow’s Ensemble dielectric platform, which are compatible with all major photoresist chemistries and standard lithographic spin-track tool platforms. Other modules for coating, cleaning, stripping, CMP, and etching are in development by Brewer and other members of the SiLKnet Alliance, the companies said.

Materials for 193nm FEOL and BEOL applications are now in customer evaluation, with 248nm versions ready later this year.


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