More and more semiconductor manufacturers are requiring advanced bumping technologies to support the large-scale expenditures in next generation products. Bumping pitches below 100 microns are considered advanced development.

(August 24, 2004) Sunnyvale, Calif.&#8212Supertex now offers 20 different packages and 233 products in lead (Pb)-free “Green” packages in its portfolio of high voltage analog and mixed signal integrated circuits and discrete transistor products. These Pb-free green parts come in response to customer requirements and international regulations restricting the use of Pb in electronic components.