IMAPS and ACerS call for papers for International Conference on Ceramic Interconnect and Ceramic Microsystems Technology

This conference will bring together a diverse set of disciplines to share experiences and promote research, development, and applications of ceramic interconnect and ceramic microsystems technologies. It will feature ceramic technology for both microsystems and interconnect applications in a dual-track technical program, as well as provide a unique opportunity for people and organizations with ceramic prototyping capabilities and interests to interact with the traditional MEMS design and fabrication communities.

(August 27, 2004) Research Triangle Park, N.C.&#8212The acquisition announced last month of Unitive Inc. by Amkor Technology, Inc. is complete. Unitive, a leading provider of wafer level technologies and services for flip chip and wafer level packaging applications, now operates as a subsidiary of Amkor.


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