(August 25, 2004) Minneapolis, Minn.— August Technology Corporation launched NSX-115, the latest addition to its NSX series of automated advanced macro defect inspection solutions. The NSX-115 is optimized for 2D gold and solder bump and probe mark inspection as well as outgoing fab quality control applications.
August Technology is expanding its NSX product family to meet a growing variety of customer applications and requirements. NSX-115 reduces the cost of ownership for a range of applications at very high throughputs and is three to five times faster than the previous model for detecting 1-5 micron defects. It enables less than two micron resolution inspection of probe marks at throughputs of more than 30 wafers per hour (200 mm).
By measuring the amount of bond pad damage and the proximity of probe marks to the edge of the bond pad, the NSX-115 can detect scrub damages that can lower bond and assembly yields. In addition, its enhanced lighting and algorithms enables it to detect gold bump defects such as nodules and craters that can cause critical failures during the interconnect process.
Additional information about this new product is available at www.augusttech.com.