Sharp uses Tessera’s technology to package many types of semiconductor devices, such as Flash memory and Flash+SRAM stacked combinations&#8212both markets in which Sharp is considered an industry leader&#8212as well as application integrated circuits and logic devices. Sharp incorporates these semiconductors into a variety of consumer products, including personal digital assistants, digital still cameras, video cameras and mobile handsets.

(August 2, 2004) Atlanta, Ga.&#8212In electronics assembly, 60 to 70% of final defects occur during the stencil printing process (SPP), a stage of surface-mount technology for printed circuit board assembly. Researchers at Georgia Tech’s Center for Board Assembly Research (CBAR) have developed a new data-driven, closed-loop control technology that adjusts electronics assembly equipment parameters in real-time, resulting in fewer defects and higher yields.