SiGen makes breakthrough in strained silicon technology

(August 12, 2004) San Jose, Calif.&#8212Silicon Genesis Corporation (SiGen) announced today that it has developed a new wafer-level uniaxial strained substrate technology.

(August 11, 2004) Tokyo, Japan&#8212Global sales of chip-making equipment rose 46.2 percent in June compared with May to $3.75 billion, helped by a sharp rise in sales in Taiwan and China, the Semiconductor Equipment Association of Japan reported Wednesday. The June figure was up 106.7 percent from a year earlier, marking it the eleventh straight month of year-on-year rises.


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