Speedline announces new alliances in Southeast Asia

Speedline’s new alliances are with Niche Tech (2004), which will provide services in Thailand; SIGMATEK Corporation in Taiwan; SIP Technology Sdn Bhd in Central and Northern Malaysia; and SIP Technology Pte Ltd in Southern Malaysia, Singapore, and Indonesia.

(August 24, 2004) Phoenix, Ariz.&#8212FlipChip International today announced its successful demonstration of 95 micron pitch bumping technology for advanced semiconductor devices at its laboratory in Phoenix, Arizona. FlipChip International has ongoing research and development projects in sub-100 micron bumping technologies as part of its extensive bumping and wafer level packaging roadmap.

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