August 26, 2004 – Toshiba Corp. plans to expand production capacity at its 200mm facility in Yokkaichi, central Japan, to 107,500 wafers/month by 1H05, a 7.5% increase, according to the Nihon Keizai Shimbun.
Financial investment for the increase already has been factored into the company’s 154 billion yen ($1.4 billion) capex budget for this year, according to Reuters. Toshiba’s new 300mm facility is expected to begin operations around that time, but the company wanted to boost production now to meet current demand for NOR flash memory chips.
Earlier expansion plans, which involved boosting output 11% to 100,000 wafers/month in 2H04, target NAND flash memory. Much of the production from the 200mm facility will be moved to the 300mm site, which also will focus on NAND flash, with the remaining 200mm lines possibly used for other products such as LCD drivers.