August 2, 2004 – Taiwan foundry United Microelectronics Corp. (UMC) has unveiled an enhanced prototyping program for verification of SOC designs on its 130-90nm process technologies.
The Shuttle Express, an extention of UMC’s multiproject test program, performs logic and/or design changes during post-initial silicon runs using just the top three metal layers, in an effort to improve turnaround time by up to 70% compared with other IC prototyping. The program will be avialble by November.