August 26, 2004 – UMC’s Japan facility plans to boost production efficiency by utilizing 300mm operations owned by its Taiwanese parent company, according to the Nihon Keizai Shimbun.
The 200mm operation in Tateyama, Chiba Prefecture, initially plans to tap UMC’s Tainan, Taiwan facility, which has 40,000 wafers/month capacity, for production using 150nm process technologies. It also has a deal to utilize 300mm-compatible production lines at UMCi in Singapore for 2000 wafers/month capacity.