AMD, IBM expand chipmaking partnership

September 23, 2004 – AMD and IBM have extended an existing chip manufacturing agreement into 2008 that will add about $250-$280 million to IBM’s coffers, according to an AMD SEC filing.

The pair’s existing deal, scheduled to expire at the end of 2005, involves joint development of chip manufacturing technology for 300mm, 65nm-45nm logic chips and microprocessors. The extension adds potential development of 32nm technologies, as well as an option for AMD to use third-party foundries for 90nm and 65nm chip manufacturing using jointly developed technology.

AMD also will use IBM’s C4 bump technology in its 300mm fab in Dresden, Germany, and has obtained a license to bump 200mm wafers for third parties.

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