Hitachi to build plant and boost power chip output

September 29, 2004 – Hitachi Ltd. plans to build another power semiconductor plant in Japan and boost production of the devices by 180%, according to the Asia Pulse Pte Ltd. The plant is scheduled to be operational in October 2005.

The plant will be built at the company’s existing plant site in the city of Hitachi, Ibaraki Prefecture, at a cost of 2 billion yen (US$18,000). Construction is slated to begin in December. The plant is expected to have floor space of about 3000 sq. m., of which cleanroom facilities will likely occupy 2400 sq. m. The plant is scheduled to begin fabricating 125mm wafers in October 2005. The production will be later shifted to 150mm wafers.

The addition of the plant is expected to increase Hitachi’s monthly power semiconductor production from the current level of 5000 150mm equivalent wafers to 7000 in FY06. The company plans to eventually boost the figure to 14,000 150mm equivalent wafers, up 180% from the current level.

Hitachi’s power semiconductor sales stand at slightly less than 20 billion yen. The bulk of the sales are related to air conditioner motors and rail cars, but the company hopes to strengthen sales of the parts for automobiles and flat-panel televisions following the addition of the plant.


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