IMAPS to hold optoelectronics device packaging workshop

The workshop will offer two professional development courses: One that covers optoelectronics packaging and processes, and another about the fundamentals of adhesion for microelectronic and optoelectronic applications. The scheduled keynote speaker is John V. Pilitsis, Ph.D., CEO of Allentown, Penn.-based CyOptics.

(September 10, 2004) London, U.K.&#8212The utilization of manufacturing capacity at wafer fabs all over the world peaked in the second quarter (Q2) of 2004 and likely will dip over the next several quarters as manufacturing capacity is brought on-stream, according to market research firm iSuppi Corp.


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