Recognizing Excellence in Innovation

It is once again with great pleasure that Advanced Packaging Magazine congratulates the winners and participants of the 2004 Advanced Packaging Awards. This was our 4th annual event in an awards program that has fast become a very prestigious and sought-after recognition. Four years ago, PennWell and SEMI developed a partnership to develop an awards program to recognize the product innovation and ingenuity of companies making leading-edge contributions to the final assembly process of semiconductor manufacturing

This year, we had winners in 19 categories from a record-breaking number of submissions in categories ranging from 3-D package design, test and inspection, to wafer thinning. The winners were chosen by a distinguished panel of judges composed of industry experts and members of academia. An Advanced Packaging crystal was presented to the winning companies at our ceremony held during Semicon West in San Jose in July. A capacity crowd applauded the companies as they were honored for their innovative contributions.

The Advanced Packaging Awards program was created to recognize the positive advancement of semiconductor packaging technology. As such, both small and large companies compete on an even playing field for the award. Each submission is judged based on its ability to meet a significant industry challenge; to creatively apply a new or existing technology; to show overall quality and consistency in performance; and to offer economic merits. All submissions are judged on innovativeness; cost effectiveness; speed and throughput improvements; quality contributions; ease of use; maintainability or reparability; and environmental responsibility.

In the following pages, you will find a presentation honoring those companies who were this year's recipients of an Advanced Packaging Award. I ask you to take a moment to learn more about these amazing products and the companies behind the innovations. These are the types of companies that continue to lead the expansion of technology within the final assembly of the semiconductor market.

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Again, congratulations to this year's winners!

John Bubello
Advanced Packaging Publisher


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