The company saw a continuation of the market recovery in electronics manufacturing that started in the first quarter, according to Speedline Technologies President Pierre de Villemejane. “Cell phone and computer production was exceptionally strong, driving higher spending for capital equipment to expand capacity,” he said.
(September 8, 2004) Scotts Valley, Calif.—Carsem, a provider of packaging and test services to the semiconductor industry, announced it will increase its capacity for the MLP (micro leadframe package) family to a total of 155 million units per month. In September 2003, Carsem had a monthly capacity of 50 million in its Malaysian factories. Since then, it has been increased to a current capacity of 90 million, and will be ramped to 135 million by November 2004.